485總線隔離收發模塊
TTL/CMOS電平(ping)和(he)485差分(fen)信號相互轉(zhuan)換的(de)隔離收(shou)發模塊。
——可(ke)實(shi)現信(xin)號隔離、信號(hao)轉換(huan)、延長(zhang)通信距(ju)離、增加(jia)通信節(jie)點(dian)、485總(zong)線防(fang)護等(deng)功(gong)能。




485總線隔離收發(fa)模塊 篩(shai)選(xuan)型號個(ge)數:共(gong) 71 個,請(qing)查看下(xia)方(fang)表(biao)格。

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係列標(biao)題
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集成電源
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通道數
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傳輸速率(bps)
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輸入電壓(VDC)
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節點數
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隔離電壓
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封裝(zhuang)形式
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特(te)性說明(ming)
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資料下載 (3D/PCB封(feng)裝庫/原理圖庫(ku))
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認證/標準(zhun)
技術(shu)
手冊(ce)樣(yang)品
申(shen)請
TDA51S485HC | √ | 1 | 500k | 3.3 | 256 | 5000VDC | SOIC | 高隔離 | - | - | - | - |
TDA51S485HC | √ | 1 | 500k | 3.3 | 256 | 5000VDC | SOIC | 高隔離 | - | |||
TD041S485H | - | 1 | 1M | 3.3,5 | 256 | 3750VDC | DFN | 超小,超薄,芯片級 DFN 封裝 | - | - | - | - |
TD041S485H | - | 1 | 1M | 5,3.3 | 256 | 3750VAC | DFN | 超小,超薄,芯片級 DFN 封裝 | - | |||
TD(H)541S485H-A | √ | 1 | 500k | 5 | 256 | 3750VDC | DFN | 超小,超薄,芯片級 DFN 封裝 | - | - | - | - |
TD541S485H-A | √ | 1 | 500K | 5 | 256 | 3000VDC | DFN | 超小,超薄,芯片級 DFN 封裝 | ||||
TD(H)541S485S-F | √ | - | 20M | 5 | 256 | 5000VDC | DFN | 超小,超薄,芯片級 DFN 封裝 | - | - | - | - |
TD541S485S-F | √ | - | 20M | 5 | 256 | 3000VDC | DFN | 超小,超薄,芯片級 DFN 封裝 | - | |||
TD(H)541S485S-F1 | √ | 2 | 20M | 5 | 256 | 3000VDC | DFN | 超小,超薄,芯片級 DFN 封裝 | - | - | - | - |
TD541S485S-F1 | √ | 2 | 20M | 5 | 256 | 3000VDC | DFN | 超小,超薄,芯片級 DFN 封裝 | - | |||
TD(H)541S485S-FT | √ | 2 | 20M | 5 | 256 | 3000VDC | DFN | 超小,超薄,芯片級 DFN 封裝 | - | - | - | - |
TD541S485S-FT | √ | 2 | 20M | 5 | 256 | 3000VDC | DFN | 超小,超薄,芯片級 DFN 封裝 | - | |||
TD041S485H-A | √ | 1 | 500k | 3.3,5 | 256 | 3750VDC | DFN | 超小,超薄,芯片級 DFN 封裝 | - | - | - | - |
TD041S485H-A | √ | 1 | 500K | 5 | 256 | 3750VDC | DFN | 超小,超薄,芯片級 DFN 封裝 | - | |||
TD041S485S-F1 | √ | 2 | 20M | 3.3,5 | 256 | 3750VDC | DFN | 超小,超薄,芯片級 DFN 封裝 | - | - | - | - |
TD041S485S-F1 | √ | 2 | 20M | 5 | 256 | 3750VDC | DFN | 超小,超薄,芯片級 DFN 封裝 | - | |||
TD301D485H-AB | √ | 1 | 11.52k | 3.3 | 128 | 2500VDC | DIP | 高隔離 | - | - | - | - |
TD301D485H-AB | √ | 1 | 11.52K | 3.3 | 128 | 2500VDC | DIP | 高隔離 | - | |||
TD341S485S-F | √ | - | 20M | 3.3,5 | 256 | 5000VDC&3000VDC | DFN | 超小,超薄,芯片級 DFN 封裝 | - | - | - | - |
TD341S485S-F | √ | - | 20M | 3.3,5 | 256 | 5000VDC&3000VDC | DFN | 超小,超薄,芯片級 DFN 封裝 | - | |||
TD341S485S-F1 | √ | - | 20M | 3.3 | 256 | 5000VDC&3000VDC | DFN | 超小,超薄,芯片級 DFN 封裝 | - | - | - | - |
TD341S485S-F1 | √ | - | 20M | 3.3 | 256 | 5000VDC&3000VDC | DFN | 超小,超薄,芯片級 DFN 封裝 | - | |||
TD341S485S-FT | √ | - | 20M | 3.3 | 256 | 5000VDC&3000VDC | DFN | 超小,超薄,芯片級 DFN 封裝 | - | - | - | - |
TD341S485S-FT | √ | - | 20M | 3.3 | 256 | 5000VDC&3000VDC | DFN | 超小,超薄,芯片級 DFN 封裝 | - | |||
TD5(3)01M485 | √ | 1 | 500K | 3.3,5 | 64 | 2500VDC | DIP | 超小體積,自動收發 | - | - | - | - |
TD301M485 | √ | 1 | 500K | 3.3 | 64 | 2500VDC | DIP | 超小體積,自動收發 | ||||
TD501M485 | √ | 1 | 500K | 5 | 64 | 2500VDC | DIP | 超小體積,自動收發 | ||||
TD5(3)21D485 | √ | 1 | 19.2K | 3.3,5 | 64 | 2500VDC | DIP | 開板式低速 | - | - | - | - |
TD321D485 | √ | 1 | 19.2K | 3.3 | 64 | 2500VDC | DIP | 開板式低速 | ||||
TD521D485 | √ | 1 | 19.2K | 5 | 64 | 2500VDC | DIP | 開板式低速 | ||||
TD5(3)21D485-L | √ | 1 | 19.2K | 3.3,5 | 16 | 3000VDC | DIP | 超低功耗 | - | - | - | - |
TD321D485-L | √ | 1 | 19.2K | 3.3 | 16 | 3000VDC | DIP | 超低功耗 | ||||
TD521D485-L | √ | 1 | 19.2K | 5 | 16 | 3000VDC | DIP | 超低功耗 | ||||
TD5(3)21D485H | √ | 1 | 200K | 3.3,5 | 64 | 3000VDC | DIP | 開板式高速 | - | - | - | - |
TD321D485H | √ | 1 | 200K | 3.3 | 64 | 3000VDC | DIP | 開板式高速 | ||||
TD521D485H | √ | 1 | 200K | 5 | 64 | 5000VDC | DIP | 開板式高速 | ||||
TD5(3)21D485H-A | √ | 1 | 500K | 3.3,5 | 128 | 3000VDC | DIP | 自動收發,開板式 | - | - | - | - |
TD321D485H-A | √ | 1 | 500K | 3.3 | 128 | 3000VDC | DIP | 自動收發,開板式 | ||||
TD521D485H-A | √ | 1 | 500K | 5 | 128 | 3000VDC | DIP | 自動收發,開板式 | ||||
TD5(3)21D485H-E | √ | 1 | 500K | 3.3,5 | 256 | 3000VDC | DIP | 增強版,總線兼容性好 | - | - | - | - |
TD321D485H-E | √ | 1 | 500K | 3.3 | 256 | 3000VDC | DIP | 增強版,總線兼容性好 | ||||
TD521D485H-E | √ | 1 | 500K | 5 | 256 | 3000VDC | DIP | 增強版,總線兼容性好 | ||||
TD5(3)21S485 | √ | 1 | 19.2K | 3.3,5 | 64 | 2500VDC | SMD | 開板貼片式,低速 | - | - | - | - |
TD321S485 | √ | 1 | 19.2K | 3.3 | 64 | 2500VDC | SMD | 開板貼片式,低速 | ||||
TD521S485 | √ | 1 | 19.2K | 5 | 64 | 2500VDC | SMD | 開板貼片式,低速 | ||||
TD5(3)21S485H | √ | 1 | 200K | 3.3,5 | 64 | 3000VDC | SMD | 開板貼片式 | - | - | - | - |
TD321S485H | √ | 1 | 200K | 3.3 | 64 | 3000VDC | SMD | 開板貼片式 | ||||
TD521S485H | √ | 1 | 200K | 5 | 64 | 3000VDC | SMD | 開板貼片式 | ||||
TD5(3)21S485H-A | √ | 1 | 500K | 3.3,5 | 128 | 3000VDC | SMD | 自動收發,開板貼片式 | - | - | - | - |
TD321S485H-A | √ | 1 | 500K | 3.3 | 128 | 3000VDC | SMD | 自動收發,開板貼片式 | ||||
TD521S485H-A | √ | 1 | 500K | 5 | 128 | 3000VDC | SMD | 自動收發,開板貼片式 | ||||
TD5(3)21S485H-E | √ | 1 | 500K | 3.3,5 | 256 | 3000VDC | SMD | 增強版,總線兼容性好 | - | - | - | - |
TD321S485H-E | √ | 1 | 500K | 3.3 | 256 | 3000VDC | SMD | 增強版,總線兼容性好 | ||||
TD521S485H-E | √ | 1 | 500K | 5 | 256 | 3000VDC | SMD | 增強版,總線兼容性好 | ||||
TD5(3)22D485H-A | √ | 2 | 120K | 3.3,5 | 32 | 2500VDC | DIP | 雙路自動收發通道隔離 | - | - | - | - |
TD322D485H-A | √ | 2 | 120K | 3.3 | 32 | 2500VDC | DIP | 雙路自動收發通道隔離 | ||||
TD522D485H-A | √ | 2 | 120K | 5 | 32 | 2500VDC | DIP | 雙路自動收發通道隔離 | ||||
TD5(3)31S485 | √ | 1 | 19.2K | 3.3,5 | 64 | 2500VDC | SMD | 小體積SMD,低速 | - | - | - | - |
TD331S485 | √ | 1 | 19.2K | 3.3 | 64 | 2500VDC | SMD | 小體積SMD,低速 | ||||
TD531S485 | √ | 1 | 19.2K | 5 | 64 | 2500VDC | SMD | 小體積SMD,低速 | ||||
TD5(3)31S485-L | √ | 1 | 19.2K | 3.3,5 | 16 | 2500VDC | SMD | 超低功耗 | - | - | - | - |
TD331S485-L | √ | 1 | 19.2K | 3.3 | 16 | 2500VDC | SMD | 超低功耗 | ||||
TD531S485-L | √ | 1 | 19.2K | 5 | 16 | 2500VDC | SMD | 超低功耗 | ||||
TD5(3)31S485H | √ | 1 | 150K | 3.3,5 | 128 | 2500VDC | SMD | 小體積SMD封裝 | - | - | - | - |
TD331S485H | √ | 1 | 150K | 3.3 | 128 | 2500VDC | SMD | 小體積SMD封裝 | ||||
TD531S485H | √ | 1 | 150K | 5 | 128 | 2500VDC | SMD | 小體積SMD封裝 | ||||
TD5(3)31S485H-A | √ | 1 | 150K | 3.3,5 | 128 | 2500VDC | SMD | 自動收發 | - | - | - | - |
TD331S485H-A | √ | 1 | 150K | 3.3 | 128 | 2500VDC | SMD | 自動收發 | ||||
TD531S485H-A | √ | 1 | 150K | 3.3 | 128 | 2500VDC | SMD | 自動收發 | ||||
TD5(3)31S485H-E | √ | 1 | 500K | 3.3,5 | 256 | 2500VDC | SMD | SMD增強版,總線兼容性好 | - | - | - | - |
TD331S485H-E | √ | 1 | 500K | 3.3 | 256 | 2500VDC | SMD | SMD增強版,總線兼容性好 | ||||
TD531S485H-E | √ | 1 | 500K | 5 | 256 | 2500VDC | SMD | SMD增強版,總線兼容性好 | ||||
TD541S485H | √ | 1 | 1M | 3.3,5 | 256 | 5000VDC&3000VDC | DFN | 超小,超薄,芯片級 DFN 封裝 | - | - | - | - |
TD541S485H | √ | 1 | 1M | 3.3,5 | 256 | 5000VDC&3000VDC | DFN | 超小,超薄,芯片級 DFN 封裝 | - | |||
TD541S485H-S | √ | - | 10M | 3.3,5 | 256 | 5000VDC | DFN | 超小,超薄,芯片級 DFN 封裝 | - | - | - | - |
TD541S485H-S | √ | - | 10M | 3.3,5 | 256 | 5000VDC | DFN | 超小,超薄,芯片級 DFN 封裝 | - | |||
TDH5(3)01D485H | √ | 1 | 115.2K | 3.3,5 | 32 | 3750VAC | DIP | 高隔離 | - | - | - | - |
TDH301D485H | √ | 1 | 115.2K | 3.3 | 32 | 3750VAC | DIP | 高隔離 | ||||
TDH501D485H | √ | 1 | 115.2K | 5 | 32 | 3750VAC | DIP | 高隔離 | ||||
TDHx01D485H-E | √ | 1 | 1M | 3.3,5 | 256 | 5000VDC | DIP | 單路高速高隔離 | - | - | - | - |
TDH301D485H-E | √ | 1 | 1M | 3.3 | 256 | 5000VDC | DIP | 單路高速高隔離 | ||||
TDH501D485H-E | √ | 1 | 1M | 5 | 256 | 5000VDC | DIP | 單路高速高隔離 | ||||
TDHx01D485H2 | √ | 1 | 1M | 3.3,5 | 128 | 5000VDC | DIP | 單路高速高隔離 | - | - | - | - |
TDH301D485H2 | √ | 1 | 1M | 3.3 | 128 | 5000VDC | DIP | 單路高速高隔離 | ||||
TDH501D485H2 | √ | 1 | 1M | 5 | 128 | 5000VDC | DIP | 單路高速高隔離 | ||||
TDx01D485H | √ | 1 | 200K | 3.3,5 | 32 | 2500VDC | DIP | 高速通用型 | - | - | - | - |
TD301D485H | √ | 1 | 200K | 3.3 | 32 | 2500VDC | DIP | 高速通用型 | ||||
TD501D485H | √ | 1 | 200K | 5 | 32 | 2500VDC | DIP | 高速通用型 | ||||
TDx12P485 | √ | 2 | 9.6K | 3.3,5 | 32 | 2500VDC | DIP | 雙通道低速 | - | - | - | - |
TD312P485 | √ | 2 | 9.6K | 3.3 | 32 | 2500VDC | DIP | 雙通道低速 | - | |||
TD512P485 | √ | 2 | 9.6K | 5 | 32 | 2500VDC | DIP | 雙通道低速 | - | |||
TDx12P485H | √ | 2 | 200K | 3.3,5 | 32 | 2500VDC | DIP | 雙通道 | - | - | - | - |
TD312P485H | √ | 1 | 200K | 3.3 | 32 | 2500VDC | DIP | 雙通道 | - | |||
TD512P485H | √ | 1 | 200K | 5 | 32 | 2500VDC | DIP | 雙通道 | - | |||
TDx1IP485H | √ | 2 | 115.2K | 3.3,5 | 32 | 2500VDC | DIP | 雙通道相互隔離 | - | - | - | - |
TD31IP485H | √ | 2 | 115.2K | 3.3 | 32 | 2500VDC | DIP | 雙通道相互隔離 | - | |||
TD51IP485H | √ | 2 | 115.2K | 5 | 32 | 2500VDC | DIP | 雙通道相互隔離 | - | |||
TLAxx-03K485 | √ | 2 | 500k | 100-430 | 128 | 4000VAC | DIP | 開板式低速 | - | - | - | - |
TLA05-03K485 | √ | 2 | 500k | 100-430 | 128 | 4000VAC | DIP | 開板式低速 | ||||
TD5(3)B1D485H | √ | 1 | 200K | 3.3,5 | 64 | 3000VDC | DIP | 開板式高速 | - | - | - | - |
TD3B1D485H | √ | 1 | 200k | 3.3 | 64 | 3000VDC | DIP | 高速通用型 | ||||
TD5(3)B1D485H-A | √ | 1 | 500K | 3.3,5 | 128 | 3000VDC | DIP | 自動收發,開板式 | - | - | - | - |
TD3B1D485H-A | √ | 1 | 500k | 3.3 | 128 | 3000VDC | DIP | 高速通用型 | - | |||
TDx01D485 | √ | 1 | 9.6K | 3.3,5 | 32 | 2500VDC | DIP | 高隔離 | - | - | - | - |
TD301D485 | √ | 1 | 9.6K | 3.3 | 32 | 2500VDC | DIP | 高隔離 | - | |||
TD501D485 | √ | 1 | 9.6K | 5 | 32 | 3000VDC | DIP | 增強版,總線兼容性好 | - | |||
TDx01D485H-A | √ | 1 | 115.2k | 3.3,5 | 32 | 2500VDC | DIP | 自動收發 | - | - | - | - |
TD501D485H-A | √ | 1 | 115.2k | 5 | 32 | 2500VDC | DIP | 自動收發 | ||||
TD301D485H-A | √ | 1 | 115.2k | 3.3 | 32 | 2500VDC | DIP | 自動收發 | ||||
TDx01D485H-E | √ | 1 | 500k | 3.3,5 | 256 | 3000VDC | DIP | 增強版,總線兼容性好 | - | - | - | - |
TD301D485H-E | √ | 1 | 500k | 3.3 | 256 | 3000VDC | DIP | 增強版,總線兼容性好 | ||||
TD501D485H-E | √ | 1 | 500k | 5 | 256 | 3000VDC | DIP | 增強版,總線兼容性好 | ||||
TDx11D485H | √ | 1 | 200k | 3.3,5 | 32 | 3000VDC | DIP | 高隔離 | - | - | - | - |
TD311D485H | √ | 1 | 200k | 3.3 | 32 | 3000VDC | DIP | 高隔離 | - | |||
TD511D485H | √ | 1 | 200k | 5 | 32 | 3000VDC | DIP | 高隔離 | - |
* 上(shang)方產品參(can)數僅(jin)供(gong)參考(kao),詳(xiang)細(xi)技術參數請以(yi)技術規(gui)格書為(wei)準
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